bonw16: Overview & repairs #306
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| ## Replacing the RAM: | ||
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| The Bonobo WS 16 supports up to 192GB (4x48GB) of DDR5 SO-DIMMs running in dual-channel configuration at 5600MHz. The supported configurations are two or four SO-DIMMs (one or three SO-DIMMs are not supported configurations). If you've purchased new RAM, need to replace your RAM, or are reseating your RAM, follow these steps. |
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I think single-SODIMM configs are supported, but only in certain slots. Would it be helpful to include a slot order for RAM installation? It's not so bad when there are only two slots, but four gets a little more complicated. Here's the one from the manual, for reference:
Also, I'm not sure the speed goes up to 5600MHz on this machine? If not, this also should be updated in README.md
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What manual file are you referencing? This is the page I have for the X580WNRST PDF I pulled from Dropbox:
We are advertising 5600 MHz on the sales page, so if that's wrong, then it also needs to be corrected there:
| The system has three bottom-firing speakers, which can be removed and replaced individually. | ||
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| **Part numbers:** | ||
| - Subwoofer: |
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Should this line be removed until we have the part number?
| 4. Remove any clear tape covering the fan wires. | ||
| 5. Unplug the black fan connectors from the motherboard's fan headers, `J_VGAFAN1` (highlighted red above) and `J_CPUFAN1` (highlighted green). | ||
| 6. Remove the heatsink/fans from the case, being careful not to bend the heatsink pipes. It may take some pressure to break the seal of the thermal paste. | ||
| 7. Using a paper towel, remove the existing thermal paste from the CPU, GPU, VRAM chips, and heatsink. You may also use a small amount of rubbing alcohol if the old paste is dried or difficult to remove. |
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I believe what's used on the VRAM chips is a more delicate and less dense thermal pad, not liquid thermal paste like what is used on CPU/GPU dies directly. Are we sure we want to direct readers to remove these pads and use liquid paste on the VRAM chip packages? I imagine it'll work, but it seems like it could make quite a mess.
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We directed this for the VRAM chips on bonw15, oryp12, oryp11, serw13, addw4, and addw3. If the pad's delicate enough to break apart when the heatsink's removed, it seems like it'd be good to replace it with either a new pad or an alternative like thermal paste, no? It's difficult to imagine it making great contact with how it pulls apart.
If we want to walk this back, I suppose I'd need another bonw16 unit to retake the photos for that process, or alternatively we could add a note that it's optional to do that for the VRAM chips.
This adds port diagrams, component/connector overviews, and a repair manual for the Bonobo WS 16 (bonw16).
Also made a small adjustment to wording in the bonw15 section (it has three ribbon cables for its keyboard, so the word "both" shouldn't have been used to refer to them).